Semiconductor packaging structure and method for manufacturing the same

ABSTRACT

The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface adjacent to the first surface. A first electrode line with two ends are provided on the first surface and the first lateral surface, and a second electrode line with two ends are provided on the first surface and a second lateral surface respectively. A semiconductor device is provided on the first surface of the conductive substrate which electrically connected to the first electrode line and the second electrode line, a protective plate with through holes covers the first surface, and a sheathing overlays the semiconductor device.

BACKGROUND

1. Technical Field

The present application is related to a packaging structure for asemiconductor device, and a method for manufacturing the packagingstructure.

2. Description of Related Art

Solar cells are usually packed and realized as semiconductor devices.During operation of such semiconductor devices, temperature ofsemiconductor devices will be raised due to heat created by solar cells.Therefore, operation efficiency of the semiconductor devices for solarcells will decrease. Holders help dissipate heat created by thesemiconductor devices, but dissipation through holders is not veryefficient. A heat dissipation plate is usually provided on one side ofthe circuit board, opposite to another side that semiconductor devicesare provided on, to dissipate heat of the semiconductor devices.However, such package easily forms heat spots, thus heat dissipation isneither prompt nor uniform. Therefore, a packaging structure forsemiconductor devices with high heat dissipation efficiency isdesirable.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart of one embodiment of a semiconductor packagingmethod of the present application.

FIG. 2 is a schematic drawing showing one embodiment of a conductivesubstrate with a first electrode line and a second electrode lineprovided on the conductive substrate of a packaging structure asdisclosed.

FIG. 3 is a schematic drawing showing one embodiment of a semiconductordevice provided on the conductive substrate of FIG. 2, which iselectrically connected to the first electrode line and the secondelectrode line.

FIG. 4 is a schematic drawing showing one embodiment of a protectivepanel provided on the conductive substrate of FIG. 3, which comprisesthrough holes.

FIG. 5 is a schematic drawing showing one embodiment of a sheathingprovided within the through holes of FIG. 4.

FIG. 6 is a schematic drawing showing one embodiment of conductive gelprovided in the lateral of the conductive substrate of FIG. 5.

FIG. 7 is a schematic drawing showing one embodiment of a cool watertube provided under the conductive substrate of FIG. 6.

DETAILED DESCRIPTION

FIG. 1 shows one embodiment of a flowchart for the semiconductorpackaging method of the present application. In step S1, a conductivesubstrate comprising a first surface, a first lateral surface and asecond lateral surface adjacent to the first surface is provided. Instep S2, a first electrode line and a second electrode are provided onthe conductive substrate, in which two ends of the first electrode lineare provided on the first surface and the first lateral surface of theconductive substrate, and two ends of the second electrode line areprovided on the first surface and the second lateral surface of theconductive substrate. In step S3, a semiconductor device is provided onthe first surface of the conductive surface, which is electricallyconnected to the first electrode line and the second electrode line. Instep S4, a protective plate with through holes is provided on the firstsurface of the conductive substrate to overlay the first surface, inwhich the semiconductor device is positioned inside the through holes.In step S5, a sheathing is provided inside the through holes to overlaythe semiconductor device and to form a semiconductor packagingstructure.

FIG. 2 shows one embodiment of a conductive substrate 10 of asemiconductor packaging structure as disclosed, which comprises a firstsurface 101, a second surface 102 opposite to the first surface 101, afirst lateral surface 105 and a second lateral surface 106 positionedbetween the first surface 101 and the second surface 102. The lateralsurface 105 is adjacent to the first surface 101 and the second surface102. In one embodiment of the present application, the material of theconductive substrate 10 may be aluminum. In other embodiments, theconductive substrate 10 can alternatively be copper, iron, or ceramics,for example.

A first electrode line 201 and a second electrode line 202 are providedon the conductive substrate 10, in which two ends of the first electrodeline 201 are provided on the first surface 101 and the first lateralsurface 105, and two ends of the second electrode line are provided onthe first surface 101 and the second lateral surface 106, respectively.In one embodiment of the present application, the first electrode line201 and the second electrode line 202 are provided through a silver jetapplication. The first electrode line 201 and the second electrode line202 can be also provided through a gold silk-screen printing.

FIG. 3 shows one embodiment of a semiconductor device 30, provided onthe first surface 101 of the conductive substrate 10 of FIG. 2,electrically connected to the first electrode line 201 and the secondelectrode line 202. The semiconductor device 30 comprises a thirdelectrode 301 and a fourth electrode 302 positioned on the same side.The third electrode 301 and the second electrode 302 are connected tothe first electrode line 201 and the second electrode line 202 throughgold lines. The semiconductor device 30 is provided on the first surface101 through adhesively attaching. In the embodiment of the presentapplication, the semiconductor 30 is a solar cell, but it canalternatively be a light emitting diode. The third electrode 301 and thefourth electrode 302 can be also positioned on different sides.

FIG. 4 shows one embodiment of a protective panel 40 with through holes401, which is provided on the first surface 101 of the conductivesubstrate 10 of FIG. 2, to overlay the first surface 101. Thesemiconductor device 30 is provided within the through hole 401. In oneembodiment of the present application, an adhesive layer 50 is providedon the first surface 101, and the protective plate 40 is combined withthe conductive substrate 10 therethrough.

FIG. 5 shows one embodiment of a sheathing 60, provided within thethrough holes 401, to overlay the semiconductor device 30 for formingthe semiconductor packaging structure 70. In one embodiment, thesheathing 60 may be formed by mold filling silicone gel into the throughholes 401, and solidifying the silicone gel. The sheathing 60 canprevent air reacting with the semiconductor 30, thereby increasingefficiency of the semiconductor 30. The material of the sheathing 60 canalso be epoxy resin, or other pervious materials.

FIG. 6 shows one embodiment of conductive gel 205 applied to a portionof the first electrode line 201 and the second electrode line 202 forelectrical conductance.

FIG. 7 shows one embodiment of a cool water tube 80 joined with thesecond surface 102 of the conductive substrate 10 to provide improvedheat dissipation. In one embodiment of the present application,dielectric conductive gel 90 of polyetherimide is provided on a surfaceof the cool water tube 80 to join the second surface 102 of theconductive substrate 10 with the cool water tube 80. The dielectricconductive gel 90 can also be polycarbonate or polystyrene.

The disclosed semiconductor structure 70 provides improved heatdissipation and prevents heat spots through by directly providing thesemiconductor device 30 on the conductive substrate 10. The cool watertube 80 is provided to the semiconductor packaging structure 70 toenhance heat dissipation.

While the invention has been described by way of example and in terms ofpreferred embodiment, it is to be understood that the invention is notlimited thereto. To the contrary, it is intended to cover variousmodifications and similar arrangements (as would be apparent to thoseskilled in the art). Therefore, the scope of the appended claims shouldbe accorded the broadest interpretation so as to encompass all suchmodifications and similar arrangements.

1. A semiconductor packaging structure, comprising: a conductivesubstrate comprising a first surface, a first lateral surface and asecond lateral surface adjacent to the first surface; a first electrodeline and a second electrode line provided on the conductive substrate,wherein two ends of the first electrode line are provided on the firstsurface and the first lateral surface, and two ends of the secondelectrode line are provided on the first surface and the second lateralsurface; a semiconductor device provided on the first surface of theconductive substrate, electrically connected to the first electrode lineand the second electrode line; a protective plate with through holes,wherein the first surface of the conductive substrate is covered by theprotective plate, and the semiconductor device is provided inside thethrough holes; a sheathing provided in the through holes to overlay thesemiconductor device.
 2. The semiconductor device package structure asclaimed in claim 1, wherein the conductive substrate is made of metal orceramics.
 3. The semiconductor device package structure as claimed inclaim 1, wherein the semiconductor device comprises a first electrodeand a second electrode electrically connected to the first electrodeline and the second electrode line, respectively.
 4. The semiconductordevice package structure as claimed in claim 1, wherein the sheathing ismade of silicone or epoxy resin.
 5. The semiconductor device packagestructure as claimed in claim 1, wherein the semiconductor devicepackage structure comprises a cold water tube joined with a secondsurface of the conductive substrate, which is opposite to the firstsurface.
 6. A method for packaging a semiconductor structure,comprising: providing a conductive substrate comprising a first surface,a first lateral surface and a second lateral surface adjacent to thefirst surface; providing a first electrode line and a second electrodeline on the conductive substrate, wherein two ends of the firstelectrode line are provided on the first surface and the first lateralsurface, and two ends of the second electrode line are provided on thefirst surface and the second lateral surface; providing a semiconductordevice on the first surface of the conductive surface, whichelectrically connected to the first electrode line and the secondelectrode line; providing a protective plate with through holes on thefirst surface of the conductive substrate to overlay the first surface,wherein the semiconductor device is inside the through holes; asheathing provided inside the through holes to overlay the semiconductordevice and to form a semiconductor packaging structure.
 7. The methodfor packaging a semiconductor structure as claimed in claim 6, whereinthe first electrode line and the second electrode line are provided onthe conductive substrate through ink jet or silk-screen printing.
 8. Themethod for packaging a semiconductor structure as claimed in claim 6,wherein the first surface is adhesively attached to the conductivesubstrate.
 9. The method for packaging a semiconductor structure asclaimed in claim 6, wherein the sheathing is formed by mold injectingsilicone gel into the through holes and solidifying the silicone gel.10. The method for packaging a semiconductor structure as claimed inclaim 6, further comprises providing a second surface opposite to thefirst surface, and a cold water tube joined with the second surface. 11.The method for packaging a semiconductor structure as claimed in claim10, the cold water tube is joined with the second surface by applyingdielectric conductive gel.
 12. The method for packaging a semiconductorstructure as claimed in claim 11, the dielectric conductive gel isselected from a group consisting of: polyetherimide, polycarbonate, andpolystyrene.